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Nov. 1, 2004  Vol.6 No.11 P.77 Copyright cij17logo.gif (917 bytes)


Thermal properties of boron-bitrogen containing phenol-formaldehyde resin

Su Xiaohui, Gao Jungang, Jiang Chaojie
(Department of Polymer Science, College of Chemistry and Environmental Science, Hebei University, Baoding 071002, China)

Abstract The boron-nitrogen containing phenol formaldehyde resin (BNPFR) was synthesized from phenol, formaldehyde, boric acid and ammonia water. The thermal properties of BNPFR were determined by the methods of torsional braid analysis (TBA) and thermogravimetric analysis (TGA). The results show that BNPFR have a Tg about 210ºC and good thermostability. The thermal degradation kinetics of BNPFR was investigated by TGA. It is illustrated that the thermal degradation reaction of the BNPFR follows first-order mechanism, and the half-weight loss temperature is about 150ºC higher than general phenol-formaldehyde resin.
Keywords Phenol-formaldehyde resin, Boric acid, Nitrogen, thermal analysis

1. ITRODUCTION             
Phenolic formaldehyde resins (PFRs) are used principally in the reinforced thermosetting materials. To improve the flame retardancy and thermo-oxidative resistance of PFR, the addition of boron has been reported [1-4].The boron- containing phenol-formaldehyde resin (BPFR) is a modified phenolic resin, which is obtained by introducing boron to the main chain of common phenol formaldehyde resin. The BPFR possesses many excellent performances, such as thermostability, mechanical strength, electric properties and defence of neutron radiation. But the general BPFRs are extremely sensitive to moisture. To improve the hydrolytic resistance of BPFR, the resins of B-N coordination bond have been synthesized [5,6], but the description of thermal property and degradation kinetics has been lacking until now.
    The glass transition temperature (Tg) can be used effectively to illustrate the curing reaction process and thermal properties. In this work, the BNPFR was synthesized, the torsional braid analysis (TBA) was used to determine the Tg of the BNPFR, and thermogravimetric analysis (TGA) was used to study the mechanism and kinetics of thermal degradation.

2. EXPERIMENTAL
2.1 Material
Phenol, boric acid, formaldehyde solution (37% w/w), oxalic acid, 25% ammonia water, toluene, n-butyl alcohol and para-formaldehyde were all analytically pure grades and were supplied by the Tianjin Chemical Reagent Co,China.
2.2 Synthesis of BNPFR
BNPFR used in this work was synthesized according to the literature [5,6],Changing the ratio of boron and ammonia, the resins with different boron- nitrogen ratio were obtained. Material proportion and the serial number were listed in Table 1.

Table 1 Material Proportion and Serial Number of BNPFR

Composition Phenol : Boric : Ammonia
(mol ratio)
Resin. Common PR 17 : 0 : 0
1.0N 17 : 5.5 : 1.0
2.2N 17 : 5.5 : 2.2
5.5N 17 : 5.5 : 5.5

    The molecular structure of BNPFR has the following approximate form:

2.3 Torsional braid analysis (TBA)                 
Specimens, prepared by dipping heat-cleaned glass fiber braid in the tetrahydrofuran solution of the BNPFR, were completely evaporated in vacuum.
1.
The air oven was first heated up to a desired temperature and kept for a certain period of time until the system reached the equilibrium state. Specimens were quickly set into the thermostatic baths at a curing temperature Tc between 140 and 220
ºC. After curing for 1h, respectively, they were taken out and cooled to room temperature, then their Tgs were determined by TBA with a heating rate of 2ºC/min.
2. Uncured resin was inserted into the GDP-4 TBA analyzer to determine the available curing temperature of different boron-nitrogen proportion resins.
2.4 TGA measurements               
After curing at 180
ºC for 4h, the thermal analysis was carried out on the Shimadzu DT-40 thermogravimetric analysis (TGA). About 8mg of the sample, which had been completely cured and ground to fine powers, was put into a platinum cell and placed on the detector plate, then the furnace was heated at a heating rate of 10ºC/min to 800ºC.

3. RESULTS AND DISCUSSION
3.1 Tg value and the curing process
                   
Generally, the Tg of a crosslinked resin system is related to the conversion, which depends upon the curing conditions, such as temperature and time. With these curing condition varying, the Tg of the system will be changed. So that Tg has been used directly as a parameter for conversion analysis of curing reaction. Because of the Tg of thermosetting resin is easy to be measured by TBA, it is particularly useful for the measurement at high conversion and after vitrification. In this paper, the Tg values are measured for the BNPFR specimen cured isothermally at different temperatures for various periods. Different glass transition behaviors occurred for the 2.2N resin samples with different degrees of curing temperature were shown in Table 2. As seen from Table 2, the BNPFR cured at lower temperature have a low Tg compared with those cured at higher temperature. It is because that during the curing process, cross linking reaction has occurred and the weight-average molecular weight increases, the crossing linking density increases and the mobility of the chains decreases, the chances for the molecules to collide with each other are reduced and the intermolecular reaction at this low temperature is limited. But the samples have a higher curing degree at higher temperature and the Tg value get higher. If the resin was cured at 220
ºC, there is no loss modulus peak appeared in TBA curves from 20ºC to 280ºC, this is due to that BNPFRs have good heat-resistance.

Table 2 The glass transition temperature of 2.2N resin curing at different temperature for 1h

Curing temperature (ºC) 140 160 180 200 220
Tg (ºC) 150 177 187 211 £­

    To determine the influence of boron-nitrogen proportion on Tgs, the TBA experiment of uncured resins were carried out, the results are shown in Fig.1, where E is the modulus and F is the mechanical loss tangent. As seen from Fig.1, at low temperature, the resin has not been cured, the modulus is low, and with the temperature rising the resin begins to be cured, the modulus increases. When the temperature approaches a finite value, the resin was completely cured, the modulus does not change during a certain temperature range. From Fig.1 and Table 3, it can be seen that there are the same Tg to BNPFRs of different boron-nitrogen proportion, which illustrate that nitrogen content basically have no influence on Tg of BNPFRs.

Fig.1 The TBA curve of BNPFR: (1) 1.0N, (2) 2.2N, (3) 5.5N, at heating rate of 2ºC/min.

Table 3 the Tg of different resins cured at 200ºC for 1h

Resin 1.0N 2.2N 5.5N
Tg(ºC) 214 211 214

3.2 Thermal stability and degradation kinetics
It can be seen from Fig.2, that common formaldehyde resin (PFR) has higher weight loss rate than boron-nitrogen containing phenol-formaldehyde resin. The weight loss for common PFR is over 90% at 600ºC, while the BNPFR is only 32% at the same temperature. The start temperature of weight loss is at about 420ºC, higher than that of common PFR, and the temperature of half-weight loss is about 150ºC higher than that of PFR. It is due to the formation of phenol borate linkage, which reduces the formation of ether linkage, so that the heat- resistance of BNPFR has increased greatly.
    As can be seen from Fig.2, the resins with B-N containing have the same weight loss before 320
ºC, which is about 3%. We deem that it is caused by the evaporation of water and small molecules and it has not been considered as the degradation kinetics. The weight loss of BNPFR resins increased obviously from 420ºC, but the common resin decomposed distinctly from 320ºC, which indicates that the heat-resistance of common resin is inferior to BNPFR. According to the TGA curves (Fig.2), the degradation process can be divided into two stages. In the first stage (about 420-600ºC), the weight loss is about 20%, it may be caused by the oxidation and breakage of some ether linkages and carbonyl groups. In the second stage (about 600-800ºC), the weight loss is about 55%, it is due to most ether linkage, carbonyl group, some borate B-O linkage and benzene ring may be oxidized and broken in this stage.

Fig.2 Thermogravimetric analysis of PFR (1) common PFR, (2) 5.5N, (3) 2.2N, (4) 1.0N, at heating rate of 10ºC/min in air.

    To determine the kinetic parameters of the decomposition from the thermo- gravimetric data, the first step is to evaluate the conversion of the reaction. In dynamic TGA experiments, the weight change of the sample is regarded as a function of temperature and the conversion can be expressed as
            Eq. (1)
    where is the sample weight in i stage, is the residual weight of at temperature T. Therefore, with TGA curves and Eq. (1), the conversions are calculated for different degradation stages [7,8].
    In this work, considering the multi-stage degradation process of BNPFR, the TGA data were analyzed on the basis of the Madhusdanan-Krishnan-Ninan method [8], which can be expressed by the following equation:
                           Eq. (2)
    Where A is the pre-exponential factor in the Arrhenius equation, E is the apparent activation energy, R is the universal gas constant,
f
is the heating rate, T is absolute temperature, and is the integral form of the conversion dependence function. Where . The correct form of depends on the proper mechanism of the decomposition reaction [8]. Different expressions of for some solid-state reaction mechanisms can be described as the following: in first order, is ; in second order, is ; in third order, is .
    According to the above equations, the activation energy can be obtained at different heating rates from fitting versus plots. For different degradation stages, the apparent activation energies and pre-exponential factors were all tested for different mechanism functions. Some results are listed in Table 4.

Table 4 The kinetic parameters of thermal degradation of 2.2N resin for different mechanism function at 10ºC/min heating rate

2.2N resin

Reaction order Correlation coefficient Standard deviation DE(kJ/mol)

First stage

1

0.99435 0.14963

176.44

2

0.92303 0.34783

105.07

3

0.93041 0.6974

222.91

Second stage

1

0.99339 0.18899

255.23

2

0.96389 0.23082

208.28

3

0.96613 0.46238

421.55

    As shown in Table 4, for the same degradation stage at a given heating rate, the correlation values for different mechanisms are different. According to the principle that the probable mechanism has high correlation coefficient value and low standard deviation value, the probable mechanism functions are deduced from the calculated results: the two degradation stages are all following first order mechanism. The apparent activation energies in each stage are listed in Table 5.

Table 5 Apparent activation energy of thermal degradation

DE(kJ/mol) PFR 5.5N 2.2N 1.0N
First stage 130.04 153.48 176.44 279.93
Second stage 130.01 253.31 255.23 300.87

    From the data above, we can conclude that heat-resistance of BNPFR is better than that of common PFR. The heat-resistance decreased step by step with the increase of nitrogen content, this is due to the increasing of C-N bond content, which has a lower heat-resistance than B-O bond.

4. CONCLUSION
1. TBA can be used effectively to study the curing process of BNPFR and determine Tg.
2. The N content has little influence on Tg and the proper curing temperature of BNPFR is 200
ºC. The Tg of BNPFR is at about 210ºC.
3. The modulus of the resin increases with the curing temperature increasing, and holding a certain value during a temperature range.
4. The thermal degradation process of BNPFR can be divided into two stages, and the thermal decomposition kinetics all follows the first reaction order.
5. The thermo-stability of BNPFR is better than common PR.

REFERENCES                
[1] Gao J G, Liu Y F, Wang F L. Eur. Polym. J, 2001, 37: 207-210.
[2] Liu Y F, Gao J G. Polymer Degradation and Stability, 2002, 77: 495-501.
[3] Pitts A. Flame Retardancy of Polymeric Material. New York. Marcel Dekker. 1973. chapter 2.
[4] Gerrard W. The organic chemistry of boron. London and New York: Academic Press, 1961, chapter 17.
[5] Heefel H B, Kiessling HJ, Lamper F, Schonrogge B. Ger.Offen 2436358, 1975.
[6] Heefel H B, Kiessling HJ, Lamper F, Schonrogge B. Ger.Offen 2436359, 1975.
[7] Liu Z H. Introduction of thermal analysis. Beijing: Chemical Industry Publishing Co. 1991, 100-110.
[8] Madhusudanan P M, Krishnan K, Ninan K N. Thermochim. Acta., 1986, 97: 189-201.

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